Plasma
refers to the forth condition of the matter. Plasma, that is,
is a partially or totally ionized gas, thus, that particular
gas condition in which neutral molecules, positive ions and
free electrons are all present at the same time. In this case,
plasma means low energy content: higher or lower energy content
defines a "cold" plasma compared to a "hot"
one.
Cold plasma used for the phases of pre-treatment, cleaning and
washing of a substrate of any type of material is obtained at
low pressure (vacuum). This condition allows reactions to take
place in a temperature range of 20 to 30 °C inclusive while
in conditions of atmospheric pressure these are possible only
at temperatures of hundreds of degrees. In fact, despite the
low temperature of the gas, the temperature of the electrons
is very high (from 20 to 50.000 K) due to the length of the
free run of the particles.
This makes the treatment of organic material possible (for example
plastic material), which do
not tolerate high thermic loads. Plasma of a gas is by nature
unstable and can be istinguished by its strong reactivity in
particular conditions of pressure and when there are very intense
electric fields.
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The applied electric field must supply sufficient energy to
the particles which permit a general
ionization of the gas due to reciprocal collision. The gas flow
dosage, the process pressure and the intensity of the electric
field must balance the ionizing forces and the natural tendency
of ionization decay.
The nature of a plasma varies a lot according to the type of
gas, or to the mixture of different
gases, pressure of gas/gases, form of volume which confines
the plasma itself, the type of electric field which supports
and maintains the plasma. The plasma of particular gases, among
which oxygen is always present, allows oxidation to develop
at a low temperature when it comes into contact with the surfaces
to be treated.
That is, the formation of functional groups on the surfaces
themselves which permit optimal
conditions for total cleaning to be obtained. |
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THE PROCESS
PLASMA
CLEANING
The aim of the Plasma plants produced by KOLZER is to clean
surfaces (of any nature, shape
and size) and to modify the chemical and electrostatic characteristics
of the surface of products.
Plasma is a dry, clean process which takes place at room temperature
and does not use
cleaning agents (no waste material);
- removes organic pollutants or residual layers
- increases surface tension and therefore surface wettability,
by reducing the point of contact of liquids at optimal values
- forms a surface which is able to react actively with
the contact polymers (varnishes,
adhesives, inks, etc).
By changing the nature of the process gas, and their mixtures
different surface characteristics
can be obtained.
The plants designed and produced by KOLZER are suitable for
vacuum treatments of objects
whose purpose is to obtain chemical modification of the surface
in preparation to the following treatments of varnishing,
glueing, connection, coating and decoration. The plants here
described are Semicontinuous; the goods to be treated are
inserted into the process chamber in specific loading systems
(frames, trays, baskets or sifters) and are unloaded at the
end of the treatment cycle.
PLASMA DEPOSITION
The growth of thin films on a surface can be carried out effectively
through chemical reaction in the vapour phase ( Chemical Vapour
Deposition, CVD) of composites containing the element to be
deposited. Varying the process parameters, the precursors
and the shape of the reactor, the PECVD technique allows numerous
materials to be deposited.
PECVD: Continuous research carried out by our technicians
and constant collaboration with our clients and the most important
science laboratories both national as well as foreign have
made it possibile to set up specific processes dedicated to
the most varied application fields. These research, only to
mention a few, surface hardness, low friction coefficient,
anticorrosion in acid
and alkaline environments scratchproof, non stick, antiprinting
and biocompatibility characteristics.
SYSTEM ENGINEERING
The plants consist in their main part of:
- vacuum chamber
- vacuum pumping group
- process chamber with cathodes which introduce the necessary
energy to generate plasma
- feeding system and control of gas flow
- electric feeding system and plasma control
- PLC, PC and management and control software which guarantee
that the results obtained can be reproduced
- autodiagnosis safety systems.
The process area in plasma consists of cathodes which generate
an electric discharge which supports the plasma.
The cathodes are essentially stainless steel, aluminium or
titanium plates onto which an
electric feeding is applied (a radiofrequency, microwave or
direct current).
The stainless steel treatment chamber contains all the parts
that operate in the real process:
cathodes, gas feeders, pieceholders. The chamber is internally
lined with a teflon mattress.
The hinged door, provides complete access to the chamber.
The electrodes adhere to the
chamber walls. All the other groups making up the plant are
connected to the vacuum chamber: the pumping group, the vacuum
instruments, the gas and electric feeders.
The vacuum chamber has a spy window to check the plasma. In
the testing phase, the vacuum
chamber is controlled with a helium mass spectrometer to guarantee
perfect hold and tightness.
THE PLANTS
KOLZER’s plant engineering technology stands out because it adapts
its concepts to individual client requirements. In addition, KOLZER offers qualified engineering
for complex production systems. The range of supplies includes
plant families, from the” Mini compact plant”
for research companies and laboratories, to bigger and more
complex coating systems and special plants for in-line processes
and large sized articles.
Horizontal
range DGK ®
The classical work system obtains excellent results with all
metals, also in combinations with different metals.
The most complete range of process chambers in order of size:
DGK24” diameter 610 mm
DGK36” diameter 1000 mm
DGK48” diameter 1200 mm
DGK60” diameter 1600 mm
DGK72” diameter 1800 mm
DGK100” diameter 2500 mm |
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Vertical
range MK ®
The most modern and innovative work system: the material to
be metallized is loaded directly onto the two doors of the
system, for a faster work cycle:
This family plant range:
MK48” diameter 1250 mm
MK60” diameter 1600 mm
MK72” diameter 1800 mm |
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All
the plants have automatic process control, temperature detection,
pressure and gas flow regulation, as well as different substrate
supports, including patented rapid loading systems.
Supplied on request: cold/hot water feeding, cleaning plants,
radiation plants and instruments for quality control, for example,
Kalo-Tester, Rockwell-Tester, microscope with image elaboration.
Contact our headquarters, our technicians will be at your disposal
at anytime for any information you may require.
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