Added value...
Never
as today have producers of consumer goods used coatings to add
value to their product.
PVD processes enable almost unlimited production of coatings
on any type of surface.
As far as coatings with the “metallic effect” are
concerned having high abrasion and chemical
resistance, mainly chrome and stainless steel depositions, or
carbides and nitrides of transitionmetals (for example titanium
and zirconium) are produced.
In addition to having characteristics of hardness and resistance
to abrasion innovative colours can be obtained for decorative
motifs applied to the surfaces of high quality consumer goods.
As well as being the cleanest technology among the coating techniques,
Sputtering gives a
combination of advantages like no other: first of all Sputtering
is a method of production
which is economically efficient generating the thinnest and
most uniform coating possible.
It is a dry process at low temperature. It forms an indestructible
bond between film and
substrate, (since it binds them together at a molecular level).
It offers great versatility compared to other coatings, since
being a cold transfer, it can be
used for the deposition of conducting or non conducting material
on any type of substrate,
including metals, ceramics and plastic materials which are temperature
sensitive.
In addition, the process has a deposition control which can
be repeated in the automatic mode. Therefore, this solution
adopted to create new more resistant, lighter, cleaner and more
economical materials not only revolutionizes our industry but
everyday life.
KOLZER can offer the solution
for many different sectors of production, since it not only
supplies highly productive Sputtering machines, but also the
whole “line”, projecting and producing specific
systems according to the coating needs. |
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THE PROCESS
Coating
using Sputtering is one of the most flexible methods to physically
"PVD" (Physical Vapour Deposition).
The coating material is inserted into the vacuum chamber as
a cathode under the form of a
metal plate. After the chamber has been emptied, the process
gas is introduced (argon is
usually used as it has a high atomic weight).
A high voltage is applied and the gas is introduced.
The positive argon ions go through an acceleration process on
the negative cathode and then expel the atoms of the metal plate
(evaporating material), which then fall onto the substrates
already in the chamber and condense them.
The impact of the atoms on the evaporating material produces
“Sputtering”, as a result of the acceleration given
by the succeeded particle.
Unlike many other vacuum deposition techniques, there is no
fusion of material, therefore
all the metals and alloys can be deposited with high efficiency
and high control.
If a reactive gas such as nitrogen or acetylene is introduced
into the chamber together with the process gas, the nitride
which reacts to the carbide, develops on the substrates.
Different cathodes made of different materials can be inserted
in a vacuum coating
system to produce multiple layer systems.
It is also possible to modify the combination of the single
layers by varying the combination of
the reactive gases.
KOLZER projects, engineers
and produces its own systems using magnetron sputtering
sources of any shape and size (circular, cylindrical, rectangular)
supplying a vast range of
targets (evaporating material).
"Sputtering" technology represents a real alternative
to definitively substitute chrome
electroplating coating onto metal and plastic which is considered
to be a strong
pollutant and dangerous for health.
THE PLANTS
KOLZER’s plant engineering technology stands out because it adapts
its concepts to individual client requirements. In addition, KOLZER offers qualified engineering
for complex production systems. The range of supplies includes
plant families, from the” Mini compact plant”
for research companies and laboratories, to bigger and more
complex coating systems and special plants for in-line processes
and large sized articles.
Horizontal
range DGK ®
The classical work system obtains excellent results with all
metals, also in combinations with different metals.
The most complete range of process chambers in order of size:
DGK24” diameter 610 mm
DGK36” diameter 1000 mm
DGK48” diameter 1200 mm
DGK60” diameter 1600 mm
DGK72” diameter 1800 mm
DGK100” diameter 2500 mm |
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Comes
with two loading systems with carriage to facilitate loading
and unloading.
The sizes of the plants listed can be “personalized”
in accordance to production needs.
Vertical
range MK ®
The most modern and innovative work system: the material to
be metallized is loaded directly onto the two doors of the
system, for a faster work cycle:
This family plant range:
MK48” diameter 1250 mm
MK60” diameter 1600 mm
MK72” diameter 1800 mm |
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All
the plants have plasma cleaning, automatic process control,
temperature detection,
pressure and gas flow regulation, as well as different substrate
supports, including patented rapid loading systems.
Supplied on request: cold/hot water feeding, cleaning plants,
radiation plants and instruments for quality control, for example,
Kalo-Tester, Rockwell-Tester, microscope with image elaboration.
Contact our headquarters, our technicians will be at your disposal
at anytime for any information you may require.
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